快速升降温
Rapid Heating/Cooling
升降温速率可高达 300°C/s，几分钟内完成熔化、结晶与相变测试。
Ramp rates up to 300°C/s, enabling melting, crystallization, and phase-transition tests within minutes.
ZHT 超快速高温综合分析热台
ZHT Ultra-Fast High-Temperature Stage
把 1750°C 的材料变化，看得清清楚楚。
See material change clearly at 1750°C.
从 350°C 到 1750°C，高达 300°C/s 的升降温速率。为玻璃、陶瓷、矿物和高温界面研究提供原位观察、温控和影像分析。
From 350°C to 1750°C, with ramp rates up to 300°C/s. Built for in-situ observation, thermal control, and imaging analysis across glass, ceramics, minerals, and interfaces.
温域
Range
350-1750°C
速率
Rate
300°C/s
原位
In-situ
Optical + Raman
一个系统，多种高温研究能力。
One system. Multiple high-temperature workflows.
速度、视野、气氛与数据，在同一平台完成。
Speed, vision, atmosphere, and data in one platform.
1750°C
最高稳定温度
Stable temperature
±1°C
控温精度
Temperature accuracy
300°C/s
升降温速率
Heating and cooling rate
AI
关键影像标记
Key-frame labeling
原位观测
In-situ Observation
实时观察材料在高温下的软化、熔融、气泡迁移、烧结致密化和界面润湿行为。
Observe softening, melting, bubble migration, sintering densification, and wetting behavior in real time.
气氛控制
Atmosphere Control
密闭炉膛支持受控气氛实验，为反应过程和高温稳定性研究提供条件。
A sealed furnace chamber supports controlled gas environments for reaction and stability studies.
原位综合测试
Integrated Testing
可选 SMA905 光纤接口，实现高温原位 Raman、UV-VIS 等光谱测试。
Optional SMA905 fiber interface enables high-temperature in-situ Raman, UV-VIS, and spectroscopy.
辅助加热
Auxiliary Heating
环境温度补偿，提升高温区温场均匀性。
Ambient compensation improves uniformity across the high-temperature zone.
软件分析
Software Analysis
温度曲线、图像测量、凝固/结晶分数计算和数据导出，简化实验流程。
Temperature curves, image measurement, fraction calculations, and data export streamline the workflow.
真实视野
Real-World Vision
1500°C 下，依然清晰。
Still clear at 1500°C.
即使在极端高温下，ZENITRA 依然能提供稳定、清晰的成像。材料在熔融状态下的真实行为，被转化为直接、可靠的实验数据。
Even at extreme temperatures, ZENITRA provides stable and clear imaging, turning molten-state material behavior into direct and reliable experimental evidence.
3D 打印陶瓷
3D-Printed Ceramics
看见烧结致密化的每一步。
Watch densification unfold.
在升温过程中，3D 打印材料依次经历脱脂、颗粒重排与烧结致密化。原位观察可揭示层间结构对收缩行为与致密化路径的影响。
During heating, 3D-printed materials undergo debinding, particle rearrangement, and densification. In-situ observation reveals how layered structures influence shrinkage and densification pathways.
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玻璃熔融
Glass Melting
气泡如何形成、迁移、逸出。
How bubbles form, move, and escape.
玻璃材料逐步软化并熔融，残留气体与热分解气体形成气泡，经历成核、生长与并合。随着温度升高，气泡在浮力作用下迁移并逸出。
As glass softens and melts, residual and decomposition-generated gases form bubbles that nucleate, grow, coalesce, migrate upward, and escape.
原位 Raman
In-situ Raman
同步温度与光谱演化。
Temperature and spectra, synchronized.
平台支持高温稳定加热与光学原位采集，同步获取 Raman 谱随温度演化的信息，用于揭示相变、键结构重排及反应动力学过程。
Stable heating and real-time spectral acquisition make it possible to track Raman evolution with temperature and study phase transitions, bond rearrangement, and reaction kinetics.
接触角 / 润湿性
Contact Angle / Wetting
在温度中观察界面行为。
Observe interfaces under heat.
ZENITRA 支持高温原位接触角与润湿性能测试，帮助评估材料间的接触、铺展、反应与界面稳定性。
ZENITRA supports high-temperature in-situ contact angle and wetting tests to evaluate spreading, reaction, and interface stability.
应用领域
Applications
面向材料科学的高温实验场景。
High-temperature workflows for material science.
玻璃与陶瓷
Glass & Ceramics
考察玻璃配方熔融、结晶过程及玻璃陶瓷材料的结晶化趋势。
Study glass melting, crystallization, and glass-ceramic crystallization behavior.
矿物与耐火材料
Minerals & Refractories
评估矿石、耐火材料高温熔化与凝固行为。
Evaluate melting and solidification in ores and refractory materials.
高温光谱
High-Temperature Spectroscopy
如高温 Raman、UV-VIS 等原位光谱测试。
In-situ Raman, UV-VIS, and other spectroscopy workflows.
透过性能
Transmission Testing
评估材料在高温下的光学性能。
Assess optical properties of materials under high temperature.
界面行为
Interface Behavior
观察材料间的接触、润湿与反应。
Observe contact, wetting, and reactions between materials.
溶解动力学
Dissolution Kinetics
研究材料在高温熔体中的溶解过程。
Study dissolution processes inside high-temperature melts.
技术参数
Technical Specifications
关键能力，清晰列出。
Key capabilities, clearly stated.
测温范围
Temperature Range
350-1750°C（最高稳定 1750°C）
350-1750°C (stable operation up to 1750°C)
控温精度
Temperature Accuracy
升温 ±1°C，恒温 ±1°C
Heating: ±1°C; constant: ±1°C
升/降温速度
Heating/Cooling Rate
升温 1-300°C/s；降温最高 300°C/s
Heating: 1-300°C/s; cooling: up to 300°C/s
测量温度误差
Temperature Error
±1°C
热台材质
Hot Stage Material
铂铑合金（理论最高温度 1800°C）
Platinum-rhodium alloy (theoretical max 1800°C)
成像方式
Imaging Mode
光学显微镜；激光共聚焦显微镜（CCD/CMOS 摄像头）
Optical microscope; laser confocal microscope (CCD/CMOS camera)